Drilling/Routing
The Cutting Edge Of PCB Technology
We utilize state of the art Hitachi single spindle high speed drills and routers equipped with precision vision systems. The drills are equipped with 160K low run-out spindles. That combined with Hitachi’s automatic scaling and offsetting make perfect registration a reality without the need of x-ray equipment. The routing vision aligns on each part for highly accurate edge to feature routing and precision surface sensing automates the drilling and routing of blind features. The drills electrically sense the surface when the drill tip touches the foil allowing us to control blind hole drilling depth with extreme accuracy. The routers sense the surface accurately by precision pressure foot movement.Testing
The Microcraft EMMA 6146 precision flying probe tester allows us to keep up with increasing densities technology. Using needle point probes we can accurately test .005 pads @ .010 pitch at 250 volts and 10 Mohm. The sensitivity of this equipment far exceeds the needs of the most demanding designs. All products are Net list tested to your supplied IPC-D356 or Gerber files. You can be confident that your circuits are electrically correct.
Imaging
Image consistency is a major market focus and the Orbotech Paragon
8800HI Laser Direct Imager delivers everytime. With .001 total front to back registration (.0005
per side), automatic scaling and centering, wide depth of field, and .001 mil
lines, with + - 12um positioning capability we can assure your pads will be
aligned and your images will be dimensionally correct. Large scale optics allow
a large depth of field enabling us to print multiple thickness substrates including
rigid flex panels, and defined cavity imaging. Equipped with an 8 watt laser the
8800HI is solder mask capable for perfectly registered mask defined BGA’s.
Wet Process
To ensure consistency and enhance resolution we strictly use Hollmuler spray equipment. Equipped with thin material handling conveyers and chemistry controllers the Hollmuler eliminates framing easing flex and thin core multilayer processing and provides consistent conveyor speeds. Currently we have a Hollmuler etcher, resist stripper, tin stripper, and a resist developer. Hollmuler is top of the line and this equipment has consistently exceeded our expectations by taking the guess work out of spray processing and keeping down time to a bare minimum.
Impedance
Our Polar Instruments Si8000 impedance verification station ensures that your boards meet your impedance
requirement. With
NIST traceable standards and custom designed
coupons, we can assure you that your
controlled impedance will be where you want it.
Your circuitry is built to meet IPC-6000
series standards, Class 1 to Class 3.
By running DRC’s on your designs and
checking your impedance values our
engineering department provides you
“Value Added” with up front understanding
of any design issues before
we run your order.
recent additions
Innovative Circuits, Inc. recently completed the installation of a new water treatment plant. The new system will insure water quality moving into the future and allow ICI to move forward with its laser formed via program which is scheduled to be completed by January 2013
December 2010
Innovative Circuits, Inc. has acquired new via fill and planarization equipment to expand their in house capability and hole filling quality. This Mass equipment is state of the art and moves Innovative Circuits another step up the technology ladder.
Innovative Circuits, Inc. has added a large, high temperature, vacuum press to their facility near Atlanta, Georgia. This special thermal fluid heating press offers superior temperature control for more accurate prepreg flow control and minimal warp and twist in the finished product.
April 2010
Innovative Circuits has added a second plasma chamber with additional gas ports to be used for TEFLON® processing. In addition it will provide redundancy and added capacity to their facility near Atlanta, Georgia. This addition will ensure that we can continue to meet customer demand to manufacture complex multilayer rigid boards and rigid-flex circuits in 3-5 days.
