Products types:

Flexible Circuitry: : Multilayer Rigid-flex, Single & Double-Sided

Rigid Printed Wiring Boards: Multilayer, Single & Double-Sided

Metal Core Construction: CIC, Aluminum & Copper

Heat Sinks: Aluminum & Copper

Materials (RoHs Compliant):

High performance Flexible materials from Dupont
(AP, FR, and LF).

High Performance Rigid Laminates from Isola, Nelco, Arlon, Rogers, and Ventec.

Including Polyimides, FR4’s, Teflon’s, Thermount, and Ceramic filled composites.

Mechanical:

Panel Size: 18" x 24" max; 12" x 18" min
Layer Count: 24 max.
Hole Diameter: .008 drilled, .004 laser or plasma formed microvias
Line Width & Spacing: .003 min.
Dielectric Thickness Minimums: .001 Kapton, .002 (FR-4)
Aspect Ratio: 10:1
Board Thickness: .125 max.
Soldermask Clearance: .003 min.
UL Approved Unpierced Area: 4"

Finishes:

Electroless Nickel Immersions Gold
Hot-Air Solder Leveled
Immersion Silver
Electrolytic Wire Bondable Gold
Electrolytic Hard Gold
Immersion Tin
OSP
Carbon Paste

Coatings:

LPI Soldermask, Green, Blue, Red, Black & White
Rogers Flex LPI
Silk screen, White, Black & Yellow

Special Processes:

Controlled Impedance
Blind & Buried Vias
Via Plugging: Conductive & Non-Conductive
Laser Drilled Microvias
Controlled Depth Milling
Edge Plating & Exposed Edge Plated Holes
Discreet Gold Plating